New Solder

Chip Quik Sn10/Pb88/Ag2 No-Clean Synthetic Flux Core Solder Wire features a 2.2% flux core that is easier to use than a solid core, especially for automated soldering processes. The solder wire's clear, non-corrosive, non-conductive residue is meant to be left on the board. The Sn10/Pb88/Ag2 No-Clean Synthetic Flux Core Solder Wire is a specialty wire with a higher melting point (+268°C to +290°C) for step soldering of parts that must withstand subsequent heating steps without re-melting. This Chip Quik solder wire is also ideal for high-temperature environments and silver-coated surfaces.
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Chip Quik Sn10/Pb88/Ag2 No-Clean Flux Core Solder WireFeatures 2.2% flux core that is easier to use than a solid core, especially for automated soldering.30-07-2026 -
Chip Quik SMD2088-6000 BGA Solder Spheres1.1mm-diameter lead-free spheres for larger soldering projects.26-01-2026 -
Chip Quik Sn/Bi & Sn/Bi/Ag 0.40" Solid Core Solder WireLow-temperature, lead-free wire that comes with a choice of 10cc of flux.05-09-2025 -
Chip Quik Sn42/Bi57/Ag1 0.015" Solid Core Solder WireLow temperature (+138°C melting point), lead-free tin / bismuth / silver alloy, 1oz or 2oz spools.06-08-2025 -
Chip Quik CQB Gold Bonding WiresHigh-purity gold >99.99% is designed specifically for wire bonding.07-02-2025 -
Chip Quik TS & WS Series Solder Paste CartridgesDesigned using high-quality synthetic flux and precision atomized metal powder.27-12-2024 -
Chip Quik Solder WireAvailable in various flux-core options and numerous alloy configurations.12-02-2024 -
Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAsManufactured from virgin materials to meet or exceed the requirements of a building.06-09-2023 -
Chip Quik Indium Solder Ribbon (In52/Sn48)Features 11.9N/mm2 (at 20°C) tensile strength and 118°C (244°F) melting point.05-09-2023 -
Chip Quik Solder WiresMetal alloys with more than 12 months of shelf life.21-03-2023 -
Chip Quik Sn60/Pb40 BGA Solder SphereFeaturing a 0.76mm diameter and a 183°C to 188°C melting point range.20-03-2023
