New D-Sub Cables
Amphenol Commercial D-Sub Cable Assemblies offer EMI/RFI shielding, a rugged design, and secure mating, making them ideal for environments where reliability and signal integrity are crucial. The series features a current rating of up to 3A and wire gauges of 28AWG, 26AWG, 24AWG, and 20AWG, enabling designers to make selections based on current load, flexibility, and space constraints. Amphenol Commercial D-Sub Cable Assemblies operate within a temperature range of -20°C to +80°C and support moderate power applications. These robust and versatile connectors are ideal for electronics, industrial, and commercial environments. Typical applications include data, communications, instrumentation, set-top boxes, and medical instruments.
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Amphenol D-Sub Cable AssembliesOffers EMI/RFI shielding, a rugged design, secure mating, up to 3A, and 28AWG to 20AWG wire gauges.06-01-2026
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Winchester Interconnect M83513 Micro-D ConnectorsFeature a mechanically robust and durable rectangular form factor and low contact resistance.15-09-2025 -
L-Com Heavy Duty Deluxe D-Sub Cable AssembliesUtilizes 20AWG conductors, enabling maximum current throughput and an extremely durable assembly.14-12-2024 -
L-Com Data Interconnect SolutionsConsists of D-sub adapters, D-sub cable assemblies, and D-sub connectors.12-12-2024 -
Amphenol SnapLock ConnectorsConsist of two connection cables and two connecting cables and are available in three lengths.26-11-2024 -
MicroStrain by HBK 3DM-GV7 Tactical Grade Ruggedised IMUsFeature a precision-machined aluminium enclosure and are tested to an IP68 rating.08-04-2024 -
TE Connectivity AMPLIMITE D-Subminiature Cable AssembliesDesigned for the AMPLIMITE D-Subminiature Connector family, widely used in electronic industries.08-03-2024 -
Cinch Connectivity Solutions Space Screened Micro-D Cable AssembliesConforms to M83513 requirements and suitable for military, defense, and satellite applications.01-02-2024 -
Cinch Connectivity Solutions Micro-D Jumper AssembliesDesigned for rugged, high-performance, and densely compacted interconnect applications.28-08-2023